Server Encapsulation & Thermal Management Solution
Mainly used in IC encapsulating, vehicle electronics, server, communication, power supply, high power module and CPU/GPU etc.
Thermal grease, high thermal conductivity, low thermal resistance, excellent stability, it is the priority product of server, electronics, chips and IGBT etc. in thermal management area.
Performance：
- High thermal conductivity, Low thermal resistance
- Low Oil Bleeding
- No need for curing
- Relatively easy to form lower interface thickness (BLT)
- Can be manually sizing, machine sizing, and printed with wire mesh or steel mesh