Recommend Products:
Condensation-Type Encapsulant: GOLOHO-313-AB
Transparent Dielectric Gel: GOLOHO-4402C-AB
Thermally Conductive Encapsulant: GOLOHO-4302-AB Series
Low-stress Thermally Conductive Encapsulant: GOLOHO-4413-AB，GOLOHO-4106-AB，GOLOHO-4107S-AB，GOLOHO-4110S-AB
Low Density Encapsulant: GOLOHO-4500
Encapsulant:
Condensation-Type Encapsulant
- Condensation-Type Encapsulant
Addition-Type Encapsulant
- Transparent Dielectric Gel
- Thermally Conductive Encapsulant
- Low-stress Thermally Conductive Encapsulant
Low Density Encapsulant: GOLOHO-4500
Performance:
Good flowability before curing, good self-foaming ability, easy for operation;
Neutral and non corrosive;
After curing, it can be used from -50 ° C~+200 ° C, with good waterproof and moisture-proof performance, excellent electrical insulation and flame retardant performance, long-term effective protection for components;
Compliant with the environmental requirements of RoHS, certified by UL.